TENDER FOR SUPPLY, DELIVERY AND INSTALLATION OF OPTICAL ALIGNMENT & PACKAGING SYSTEM – SCOTLAND
Reference
073040-2026
Description
Background: The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume manufacture.
For more information about this opportunity, please visit the source:
Main procurement category
Goods
Contract locations
- UKM82 – Glasgow City
Submission
Tender submission deadline
4 September 2026, 12:00pm
Contracting authority
University of Strathclyde
Region: Scotland
Organisation type: Public authority – education
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